Description:
1. Adopts high-quality 3D NAND wafer level chip.
2. Supports PCIe3.0 x4, and NVMe 1.3 protocol.
3. All-metal cooling plate is included; equipped with intelligent temperature control technology.
4. Supports TRIM to improve read/write performance and speed.
5. Supports Max. Write technology for full-disk SLC cache.
6. Supports LDPC ECC.
7. Low power consumption management.
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