We're all about the things that make building a PC such a rewarding experience. The sense of achievement. The joy of making and creating something uniquely yours in form and function and, of course, the thrill of bringing your creation to life without melting your components.
Cooler Master is launching CryoFuze, the all new line of thermal paste delivering superior bonding for your processing capabilities. Utilizing nanoparticles, CryoFuze allows for excellent thermal conductivity on all processing components for optimal heat transfer. The non-corrosive and oxidation resistant properties prevent solidification and leaves metal contact surfaces unharmed. Versatile range of temperature performance, maintaining stability from -50°C up to 250°C.
Thermal conductivity matching K value cooling requirements of 14W/mK handles even the most extreme builds.
Non-corrosive, oxidation-resistant properties leaves metal surfaces unharmed and does not solidify. Versatile temperature stability from -50°C up to 250°C.Non-corrosive
Utilizing nanoparticles for superior heat conductivity for your CPU or GPU.
Viscously balanced formula allow for easy application and clean up.
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